（07201）飞索半导体


招聘时间：2006年11月21日19：00



招聘地点：厦新厅



注意事项：请参加宣讲会并有意应聘飞索半导体的同学携简历、身份证复印件等应聘材料到场，我们将现场收取简历。



需求详述：



Product Engineer



Education and Training:



  学历和专业训练：



1. Bachelor degree in electronics.



  微电子及相关专业本科以上学历



2. Good communication (English/Chinese) skills and project management skills in a MUST.



良好的英语沟通及表达能力，有项目管理能力



Responsibility:



  工作职责：



1. Work on MCP(Multi Chip Package) development



2. Sustain the device electrical test yield to meet the goals. Work with the team on product yield improvement activities



3. Perform excelsior failure and low yield analysis by using Advantest debug tools and engineering programs.Capable of writing failure analysis report with root cause and corrective action



4. Project management on new product qualification. (Characterize and qualify new product. Responsible for full product release to production.



5. Initiate projects in the area of yield improvement, test time reduction, quality enhancement. Provide value-added engineering solutions to Product Line



6. Work with cross department such as Assembly,QE to improve manufacturing...



Test Engineer        



Education and Training:



  学历和专业训练：



1. Electronics Engineering/Electronics and Information, Bachelor above



电子工程/电子技术类大学本科以上学历



2. Fluent in English (reading, writing and speaking)



流利的英语听、说、读、写能力



3. Well known UNIX/Advantest Language



熟练应用UNIX/ADVANTEST 语言



4. Advantest or other ATE system application training experience.



有ATE 测试系统应用培训经验



5. Knowledge in Semiconductor testing. Candidate must be able to work independently and must be able to communicate effectively as he or she will communication with headquarter and support US, Penang and BKK



,熟识半导体测试原理及方法,擅长测试程序的编写及修改.较强的[屏蔽]工作能力



Responsibility:



工作职责：



1. Interfaces with Design Engineering to develop test specifications, including description of circuit testing for products in existing technologies. Provides input on feasibility of proposed tests given current test equipment for products in existing technologies



2. Participates in the evaluation of new equipment



3. Writes and debugs test programs. Resolves hardware/software problems. Interfaces with Product Engineers to resolve changes in software. Writes operating procedures relating to current equipment



4. Works with Product Engineering to define and solve yield problems



5. Works on related projects and/or assignments as needed



公司简介：



Spansion lnc



Spansion Inc. is the largest high-tech multinational enterprise in the world that is exclusively focused on Flash memory solution, including developing, manufacturing and sales. The company provides customers with the most diverse and comprehensive Flash products.



Spansion Inc. has about 8900 employees around the world. The headquarters is located in Sunnyvale, California in USA. Our MirrorBit technology is leading in the IC industry. Products are widely applied in automobiles, networking, telecommunication, personal electronic appliances, etc.



Spansion (China) Limited



As Spansion’s wholly-owned company, we are one of the first semi-conductor manufacturers that started business in Suzhou Industrial Park (SIP). The approved investment is 144 million US dollars. Presently there are over 1300 employees. Our company enjoys high reputation in IC industry for its exquisite and advanced manufacturing process as well as its leading capability of product development.



Spansion China Product Engineering



Product Engineering is a core technical department in Spansion China which provides technical leadership in flash memory development and manufacturing toward total customer satisfaction, the mission is to develop and manufacture lowest cost flash memory products with excellent quality and reliability within a shortest time to market.



The team currently has 46 engineers under the leadership of US headquarter, which has very strong product engineering and test engineering capability. The work scopes include Spansion flagship Mirrorbit (two bits per cell) 90nm technology based NOR and ORNAND flash memory development and manufacturing, SoC (System on Chip) development and manufacturing, MCP (Multi Chip Package) development, test program development, etc.