【双选会资料】天津经济技术开发区3


招聘时间：2006年11月16日



招聘地点：体育馆



招聘需求：



Title: Plating Process Engineer (Tianjin)



Scope of Responsibilities:



Plating quality control



Plating chemical/solution maintenance



Quality issue analysis/solve.



Specific Knowledge/Skills:



Bachelor degree in Electronic-Chemistry/Mental, Chemistry Engineering and related majors



2-3 years plating related working experience



Responsible, and willing to take challenge



CET4







Title: Equipment Engineer (Tianjin)



Scope of Responsibilities:



Regular equipment maintenance and continues improvement



Keep product line equipment run efficiently



Analyze and resolve problem with equipment to reach zero defect



Coordinate with equipment supplier to improve equipment capacity



Specific Knowledge/Skills:



Bachelor degree or above, major in Mechanical or Automation related major



Related working experience is preferred



Good communication and team spirit



Good command of English writing and reading







Title: Process Engineer (Tianjin)



Scope of Responsibilities:



Optimize semiconductor production process and parameter



Evaluate and improve performance of raw material



Develop new process and product



Specific Knowledge/Skills:



Bachelor degree or above, major in EE, Mechanical or Automation, Material related major



Be familiar with mechanic and electronic knowledge, process improvement



Ability of independent working and innovation



Good command of English writing and reading



Related working experience is preferred







Title: Manufacturing Engineer (Tianjin)



Scope of Responsibilities:



Organize and manage daily activity of product line



Control product quality and improve productivity



Shorten operation cycle and reduce cost



Supervise safety in manufacturing and be responsible for employee training



Specific Knowledge/Skills:



Bachelor degree in Engineering



2 years and above working experience in produce line management and organization is preferred



Good command of communication and coordination



CET 4.







Title: Planner (Tianjin)



Scope of Responsibilities:



Production capacity analysis base on data from MRS and APO



Production control: delivery rate, pre-production analysis, emergent order support, production cycle time, inventory



Plan and analyze demand of raw material



Date administration: maintain product data and system, including ASO/TSO/TMDB/VSOR/DCM, etc.



Support engineering batch



Support new production introduction



Specific Knowledge/Skills:



Bachelor degree or above, major in IE, Mechanical or Automation related major



Good command of English writing and reading



Good command of communication and team spirit







QA:







Title: Manufacturing Quality Engineer (Tianjin)



Scope of Responsibilities:



System assessment for defect prevention



Drive for effective corrective action  



Drive SPC application  



Continuous quality improvement



Specific Knowledge/Skills:



Master quality system requirements



Strong statistical application knowledge, GB/BB is preferred  



Good communication and coordination capability



Bachelor and above degree



CET-6







Title: Failure Analysis Engineer (Tianjin)



Scope of Responsibilities:



Analyze product defect on chip layer



Coordinate with product engineer to improve yield and resolve customer’s problem with application



Support material ingredient and surface analysis



Drive continues quality improvement







Specific Knowledge/Skills:



Bachelor or above degree in EE, Semiconductor related major



Rich knowledge in product testing and application, be familiar with semiconductor process



Good command of communication and coordination



Microcontroller application is preferred



RF device application is preferred



Cadence or Knights software to view layout and schematic



CET6







Title: Customer Quality Engineer (Tianjin)



Scope of Responsibilities:



Coordinate cross function team to resolve customer quality issue.



Drive implementation of corrective actions



Coordinate customer’ audit and visit



Drive continuous quality improvement



Customer care and customer satisfaction



Specific Knowledge/Skills:



Bachelor degree or above in EE, Automation, Mechanic related major



Rich knowledge in product testing and application, be familiar with semiconductor process



Be familiar with quality system (ISO9000, TS16949)



Customer Quality engineering experience is preferred. Automotive Industry background preferred.



Good communication and coordination



Fluent in English reading, writing, listening, good command of verbal English is highly preferred







MBG:







Title: Product Engineer (Xiqing)



Scope of Responsibilities:



Provide tech. support on product issues



Work with worldwide cross-functional teams from very beginning phase



Develop and debug Probe, F/T, Characterization, Burn-In and Evaluation software and hardware



Work with design, system, application and quality engineer to improve product quality



Issue product reports and work with mass production manufacturing sites



Perform analysis on Customer Quality Incident and implement containment solutions



Support qualifications (fab, probe, assembly or final test site transfers, package qualifications, etc.)



Specific Knowledge/Skills:



Bachelor degree or above, with EE, Communication or Automation related major



Work experience in testing/application fields in Semiconductor industry is preferred



Good command of oral and written English, CET4



Good communication skill and team spirit



Willing to learn, take on challenges and self-motivated











TSO:







Title: Senior Packaging R&D Engineer (Tianjin)



Scope of Responsibilities:



This position will be ranked as a senior R&D engineer, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:







New material research/co-development with supplier



New packaging technology development



Advanced material interface study



Advanced IC package failure analysis



Coordinate/lead development project independently



Communication/cooperation among global teams (US/Germany/Malaysia/Japan/France/etc.)



English will be the language for written and oral communication, strong academic/technical background will be needed in order to initiate/complete advanced R&D projects independently.







Specific Knowledge/Skills:



Ph.D degree, or at least 1 year experience in packaging technology development function with Master degree



At least CET-6 degree or equivalent English level



Majored in electronic packaging material development or general polymer science related subject.



Intention and capability to work in a cross-functional/global team environment



Independent R&D capability



Experience in R&D work of packaging technology is preferred



Experience in material analysis is preferred



公司简介：



思卡尔?半导体 （Freescale? Semiconductor，原摩托罗拉半导体部），在微电子领域拥有50年的经验。飞思卡尔半导体 (www.freescale.com) 致力于为汽车电子、消费电子、工业电子、网络和无线市场提供广泛的半导体产品。其总部位于美国德克萨斯州奥斯汀市，并在全球25个国家和地区建立了设计、制造或销售部gate。2004年，飞思卡尔半导体的销售额为57亿美元。



　　飞思卡尔中国是全球市场上举足轻重的半导体产品供应商，其利用先进技术开发制造的各种产品遍及集成电路产业的所有领域，包括集成电路研究和开发、软件开发、集成电路设计和集成电路制造等等。2004年5月2日，作为摩托罗拉半导体业务重组的一部分，飞思卡尔中国开始经营成立飞思卡尔公司继承摩托罗拉所有的半导体相关业务。目前飞思卡尔成为中国优秀的制造中心，利用高新技术从事与半导体有关的软件开发和高级集成电路研发和设计，以及在中国出售半导体产品。