【双选会资料】天津经济技术开发区3
招聘时间：2006年11月16日
招聘地点：体育馆
招聘需求：
Title: Plating Process Engineer (Tianjin)
Scope of Responsibilities:
Plating quality control
Plating chemical/solution maintenance
Quality issue analysis/solve.
Specific Knowledge/Skills:
Bachelor degree in Electronic-Chemistry/Mental, Chemistry Engineering and related majors
2-3 years plating related working experience
Responsible, and willing to take challenge
CET4
Title: Equipment Engineer (Tianjin)
Scope of Responsibilities:
Regular equipment maintenance and continues improvement
Keep product line equipment run efficiently
Analyze and resolve problem with equipment to reach zero defect
Coordinate with equipment supplier to improve equipment capacity
Specific Knowledge/Skills:
Bachelor degree or above, major in Mechanical or Automation related major
Related working experience is preferred
Good communication and team spirit
Good command of English writing and reading
Title: Process Engineer (Tianjin)
Scope of Responsibilities:
Optimize semiconductor production process and parameter
Evaluate and improve performance of raw material
Develop new process and product
Specific Knowledge/Skills:
Bachelor degree or above, major in EE, Mechanical or Automation, Material related major
Be familiar with mechanic and electronic knowledge, process improvement
Ability of independent working and innovation
Good command of English writing and reading
Related working experience is preferred
Title: Manufacturing Engineer (Tianjin)
Scope of Responsibilities:
Organize and manage daily activity of product line
Control product quality and improve productivity
Shorten operation cycle and reduce cost
Supervise safety in manufacturing and be responsible for employee training
Specific Knowledge/Skills:
Bachelor degree in Engineering
2 years and above working experience in produce line management and organization is preferred
Good command of communication and coordination
CET 4.
Title: Planner (Tianjin)
Scope of Responsibilities:
Production capacity analysis base on data from MRS and APO
Production control: delivery rate, pre-production analysis, emergent order support, production cycle time, inventory
Plan and analyze demand of raw material
Date administration: maintain product data and system, including ASO/TSO/TMDB/VSOR/DCM, etc.
Support engineering batch
Support new production introduction
Specific Knowledge/Skills:
Bachelor degree or above, major in IE, Mechanical or Automation related major
Good command of English writing and reading
Good command of communication and team spirit
QA:
Title: Manufacturing Quality Engineer (Tianjin)
Scope of Responsibilities:
System assessment for defect prevention
Drive for effective corrective action
Drive SPC application
Continuous quality improvement
Specific Knowledge/Skills:
Master quality system requirements
Strong statistical application knowledge, GB/BB is preferred
Good communication and coordination capability
Bachelor and above degree
CET-6
Title: Failure Analysis Engineer (Tianjin)
Scope of Responsibilities:
Analyze product defect on chip layer
Coordinate with product engineer to improve yield and resolve customer’s problem with application
Support material ingredient and surface analysis
Drive continues quality improvement
Specific Knowledge/Skills:
Bachelor or above degree in EE, Semiconductor related major
Rich knowledge in product testing and application, be familiar with semiconductor process
Good command of communication and coordination
Microcontroller application is preferred
RF device application is preferred
Cadence or Knights software to view layout and schematic
CET6
Title: Customer Quality Engineer (Tianjin)
Scope of Responsibilities:
Coordinate cross function team to resolve customer quality issue.
Drive implementation of corrective actions
Coordinate customer’ audit and visit
Drive continuous quality improvement
Customer care and customer satisfaction
Specific Knowledge/Skills:
Bachelor degree or above in EE, Automation, Mechanic related major
Rich knowledge in product testing and application, be familiar with semiconductor process
Be familiar with quality system (ISO9000, TS16949)
Customer Quality engineering experience is preferred. Automotive Industry background preferred.
Good communication and coordination
Fluent in English reading, writing, listening, good command of verbal English is highly preferred
MBG:
Title: Product Engineer (Xiqing)
Scope of Responsibilities:
Provide tech. support on product issues
Work with worldwide cross-functional teams from very beginning phase
Develop and debug Probe, F/T, Characterization, Burn-In and Evaluation software and hardware
Work with design, system, application and quality engineer to improve product quality
Issue product reports and work with mass production manufacturing sites
Perform analysis on Customer Quality Incident and implement containment solutions
Support qualifications (fab, probe, assembly or final test site transfers, package qualifications, etc.)
Specific Knowledge/Skills:
Bachelor degree or above, with EE, Communication or Automation related major
Work experience in testing/application fields in Semiconductor industry is preferred
Good command of oral and written English, CET4
Good communication skill and team spirit
Willing to learn, take on challenges and self-motivated
TSO:
Title: Senior Packaging R&D Engineer (Tianjin)
Scope of Responsibilities:
This position will be ranked as a senior R&D engineer, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:
New material research/co-development with supplier
New packaging technology development
Advanced material interface study
Advanced IC package failure analysis
Coordinate/lead development project independently
Communication/cooperation among global teams (US/Germany/Malaysia/Japan/France/etc.)
English will be the language for written and oral communication, strong academic/technical background will be needed in order to initiate/complete advanced R&D projects independently.
Specific Knowledge/Skills:
Ph.D degree, or at least 1 year experience in packaging technology development function with Master degree
At least CET-6 degree or equivalent English level
Majored in electronic packaging material development or general polymer science related subject.
Intention and capability to work in a cross-functional/global team environment
Independent R&D capability
Experience in R&D work of packaging technology is preferred
Experience in material analysis is preferred
公司简介：
思卡尔?半导体 （Freescale? Semiconductor，原摩托罗拉半导体部），在微电子领域拥有50年的经验。飞思卡尔半导体 (
www.freescale.com) 致力于为汽车电子、消费电子、工业电子、网络和无线市场提供广泛的半导体产品。其总部位于美国德克萨斯州奥斯汀市，并在全球25个国家和地区建立了设计、制造或销售部gate。2004年，飞思卡尔半导体的销售额为57亿美元。
飞思卡尔中国是全球市场上举足轻重的半导体产品供应商，其利用先进技术开发制造的各种产品遍及集成电路产业的所有领域，包括集成电路研究和开发、软件开发、集成电路设计和集成电路制造等等。2004年5月2日，作为摩托罗拉半导体业务重组的一部分，飞思卡尔中国开始经营成立飞思卡尔公司继承摩托罗拉所有的半导体相关业务。目前飞思卡尔成为中国优秀的制造中心，利用高新技术从事与半导体有关的软件开发和高级集成电路研发和设计，以及在中国出售半导体产品。
