苏州研究所
PACKAGE
   Microelectronic Packaging Engineer
Job Area
Package Design
Packaging Materials Development, Packaging Process Development
Package Reliability/Analysis, Package Mechanical/Electrical Simulation
Work experience:
Experienced Persons in Packaging Development Area are preferred.
Qualification
BS, MS, or Ph.D. degree in Mechanical Engineering, Material Science, Electrical Engineering, Polymer Science, etc.
Strong Communication Skill
Fluent English Speakers
杭州研究所
MOBILE
   Mobile Solution Engineer
Responsibility:
LINUX Engineer: develop applications such as telephony service module, Games, Media Player,GUI Develop linux device driver, multimedia codec, new kernel porting and upgrading, etc.
RTOS BSP Engineer: develop the BSP and device driver of ARM9 and ARM11 series for RTOS such as VxWorks, ECOS.
WINCE engineer: develop BSP and device driver of ARM9 and ARM11 series for WINCE. Develop the applications such as multimedia player, camera and so on.
Software Configuration Management Engineer: maintain the software configuration system. Be responsible for software code merging, version control, bug trace, database backup and status report.
Hardware Engineer: develop H/W System such as Smartphone, PDA, PMP, POS, E-dictionary, etc. including design circuit schematic, PCB Routing, debug and test. Develop Firmware Code based on ARM7, 9, 11, such as LCD, Memory, Camera, MMC/SD, Audio Codec (AC97, IIS), SPI, IIC, Power management IC and ADC Control.
Sourcing Engineers: search and communicate with third party for hardware and software solution. Collect information and prepare document. Do sample application and components management.
EDA Engineer: discuss with hardware circuit design engineer and draw schematic, help to generate and maintain BOM list. Do PCB routing which contain high-speed module, prepare documents and contact with PCB manufacturer. Support PCB assembly.

Requirements:
- Bachelor, Master, or Doctor Degree in Electronic Engineering, computer and etc.
- Excellent communication, team work and adaptability
- Good English or Korean language skills

   Mobile AP Design Engineer
Responsibility:
Mobile Application Processor (ARM & DSP based SOC) Design related works.
What is Application Processor?
Optimized processors at the heart of mobile products enable communications, computing and multimedia functions to be efficiently executed. (Ex. Mobile phone, Smart phone, PDA, PMP,
GPS Handheld, and all kind of mobile products)
Requirements:
1.   Investigate Samsung/ Intel/ TI or other ARM processor
2.   Design embedded system
3.   Using 'C' and ARM assembler language
4.   Using schematic tools(PADS, OrCAD)
5.   Design digital logic(FPGA)
6.   Can develop the device driver for RTOS(WinCE, Linux, pSOS, Nucleus, etc)
- Good English skill.
- Excellent communication, teamwork and adaptability.

MEDIA
   Media Solution Engineer
①．   S/W
Responsibility:
- Develop DVD back-end software on normal DVD, car DVD and portable DVD.
- Develop back-end software on CD/VCD/SVCD/MP3/JPEG etc.
Requirements:
- Bachelor or Master degree on Electronic Engineering, Computer Science or related.
- People with work experience on DVD or CD/VCD player related software development or testing is considered first.
- Familiar with (one or several conditions satisfied):
1) MPEG, JPEG or Audio Coding and API.
2) OS or embedded OS, File system
3) GUI, OSD and Application software
4) System solution design.
5) ATAPI
②．   H/W
Responsibility:
- Develop DVD/CD H/W on normal DVD, car DVD, portable DVD player and DVD-Recorder.
Requirements:
- Bachelor or Master degree in Electronic Engineering, Automation or related.
- People with work experience on DVD/CD H/W development are considered first.
- Familiar with:
1) CD/VCD/DVD Standards and Records.
2) Knowledge of Control Theory & Electronic Circuit, Embedded System Development.
3) Optimization for Servo system
4) Knowledge of WSC and ALPC for Recorder.
5) Experience for mass product of DVD, VCD , CD player and DVD-Recorder.
COMMON Requirements
- Strong C programming skill.
- Good English skill.
-   Excellent communication, teamwork and adaptability.

MCU
   MCU IC Design & Application Engineer
①．   MCU IC Design Engineer:
Responsibility:
Develop MCU IC (Digital logic / analog circuit design, static timing analysis, Back-end layout, IC verification)
Requirements:
- Bachelor or Master Degree in Electronic Engineering or related Discipline.
- People with work experience in digital/analog circuit design (or layout)
- Familiar with:
1) Knowledge of MCU / DSP, ASIC, and CMOS circuit.
2) Familiar with SOC design based on MCU / DSP core (especially 8 / 16 bit).
3) Experience for top-down design flow (RTL coding, logic synthesis, static timing analysis, DFT, ATPG, and P/G)
4) Knowledge of EDA tools (Hspice, Verilog HDL, Design Compiler)
②．   MCU Application Hardware & Software Engineer:
Responsibility:
- Writing a specification of MCU product, especially home appliance and LCD application.
- Develop hardware and software on MCU test board / demo board.
Requirements:
- Bachelor or Master degree on Electronic Engineering, Computer Science or related.
- People with work experience on MCU application
- Familiar with:
1) 8/16/32 bit MCU application
2) C / Assembler language, GUI, OSD and Application software
3) System solution design.
4) FPGA
Common Requirements
- Fluent in English and good communication skills.
- Good co-operating attitude, strong passion & responsibility

ANALOG
   CMOS Analog Circuit Design Engineer
Responsibility:
- CMOS Analog / Mixed Signal Circuit Design of One or More of ADC, DAC, PLL, DLL Driver Amp., Regulator, DC-DC Up/Down Converter, Filter, Special IO (USB1.1-PTG, PCI, SSTL, LVDS, RSDS, etc.) Circuits
- Circuit & Mixed Signal System Level Design and etc.
Requirements:
1. Master Degree.
2. Project or working experience related to Analog IC Design Area.
3. Papers published on CMOS Analog Circuit related magazines (such as ISCC, CICC) are preferred.
4. Specialized in Electrical Engineering (Master).
5. Fluent English and EDA experience are preferred.
7.   Excellent communication, teamwork and adaptability.

   Full Manual Layout Engineer
Responsibility:
- Full Manual Layout.
Requirements:
1. Bachelor Degree or above.
2. Project or working experience related to Analog IC Design or Layout Area.
3. Papers published on CMOS Analog Circuit related magazines (such as ISCC, CICC) are preferred.
4. Specialized in Electrical Engineering.
5. Fluent English and EDA experience are preferred.
6. Excellent communication, team work and adaptability.

MARKETING:
   Marketing & Planning Engineer
Responsibility:
1. Communication with HQ's Strategy and Management process (Patent, Project Process(Dias+) etc.)
2. Researching for new technology and product (Mobile, Media, MCU)
3. Market research for SSCR's product and solution
4. Development of Business model (Collaboration and Skill for reviewing agreement)
Requirements:
1. MBA or Master grade but had to graduate from electronics’ bachelor
2. Excellent English or Korean skills.
3. Over 2 year's career in Marketing and Planning side is preferred.


[ 此贴被太阳日在2006-09-30 13:00重新编辑 ]

楼主写错字了喔。

已经晕了

估计招的都是研究生

不错啊，本科就可以去了

这个要仔细研究研究

晕全英文不想看了

每过六级估计直接抠鼻屎

除了个模拟设计工程师，其他本科都可以投，不过估计没戏！
全手工版图工程师 这个寒！